Sn62.8Pb36.8Ag0.4 183℃ Melting Point Solder Paste, No-Clean Tin Lead Cream, Solder Flux Paste For PCB/IC/BGA/SMD CELLPHONE CPU Repairing(30G)
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Sn62.8Pb36.8Ag0.4 183℃ Melting Point Solder Paste, No-Clean Tin Lead Cream, Solder Flux Paste For PCB/IC/BGA/SMD CELLPHONE CPU Repairing(30G)

Amazon Price History

This is our record of Amazon price changes for Sn62.8Pb36.8Ag0.4 183℃ Melting Point Solder Paste, No-Clean Tin Lead Cream, Solder Flux Paste For PCB/IC/BGA/SMD CELLPHONE CPU Repairing(30G) (B0BVKB732J) since we began monitoring it.

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Amazon (Jul 01, 2026) (Jul 01, 2026) 0,00 € (Jul 01, 2026)

0,00 €

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Jul 01, 2026 08:28 PM

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